Black Friday

Free Shipping!

Customer Service Award

No clean silver solder paste 35 g Sn63 Pb37 25 to 38 µm 50 Pa s for BGA and GSM pads reflow Rosfix

Hover over the image to zoom in

No clean silver solder paste 35 g Sn63 Pb37 25 to 38 µm 50 Pa s for BGA and GSM pads reflow Rosfix
No clean silver solder paste 35 g Sn63 Pb37 25 to 38 µm 50 Pa s for BGA and GSM pads reflow Rosfix

No clean silver solder paste 35 g Sn63 Pb37 25 to 38 µm 50 Pa s for BGA and GSM pads reflow Rosfix

Brand: Rosfix - KZ7U-HAXC
Sold by: Habitium
€16.04
Free shipping From 3 to 5 business days
No clean silver solder paste 35 g Sn63 Pb37 25 to 38 µm 50 Pa s for BGA and GSM pads reflow Rosfix

No clean silver solder paste 35 g Sn63 Pb37 25 to 38 µm 50 Pa s for BGA and GSM pads reflow Rosfix

€16.04 VAT included VAT included

€16.04 VAT included VAT included

No clean silver solder paste 35 g Sn63 Pb37 25 to 38 µm 50 Pa s for BGA and GSM pads reflow Rosfix

Product details

  • Weight: 35 g in a compact container, ideal for electronic assembly and reflow operations.
  • Silver formula: The silver content improves wetting and solder joint quality, providing reliable and durable connections.

Payment methods and financing

PayPal Visa MasterCard Maestro American Express Wire Transfer

Ask a question about this product Average response time: 4 working hours

Product details - No clean silver solder paste 35 g Sn63 Pb37 25 to 38 µm 50 Pa s for BGA and GSM pads reflow Rosfix

  • Weight: 35 g in a compact container, ideal for electronic assembly and reflow operations.
  • Silver formula: The silver content improves wetting and solder joint quality, providing reliable and durable connections.
  • No Clean type: No post-soldering cleaning is required, streamlining production and reducing processing time.
  • Melting temperature: 183 °C, suitable for easy flux activation and application in manual and automatic soldering processes.
  • Alloy: Sn63/Pb37 provides a low melting point and excellent flow for precise work on BGA pads and GSM technology.
  • Particle size: 25–38 µm ensures even distribution and a professional soldering finish.
  • Viscosity: 50 Pa·s enables controlled and uniform application to the surfaces being soldered.
  • Flux: The resin and solvent based flux supports natural cleaning during soldering without leaving corrosive residues.
  • Recommended storage: Store between 0 °C and 10 °C to maintain the product’s optimum properties.
  • Compatibility: Suitable for reflow ovens and standard heating equipment that reaches the temperature required for flux activation and soldering.
  • Applications: Designed for pre-tinning BGA pads and manual or automatic soldering of SMT and BGA components, making it ideal for electronic production and repairs.
  • Packaging: Includes basic technical documentation and protective packaging for safe transport and product storage.

Product classification::

This product belongs in the category Welding (welders): with tin (handheld, electronic, plastic).

SKU: 5905954101702, KZ7U-HAXC

Safety Resources and Products

Information and contacts