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No clean soldering flux and liquid solder paste gel 10cc 42g 183°C for BGA SMD SMT repair Rosfix

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No clean soldering flux and liquid solder paste gel 10cc 42g 183°C for BGA SMD SMT repair Rosfix
No clean soldering flux and liquid solder paste gel 10cc 42g 183°C for BGA SMD SMT repair Rosfix
No clean soldering flux and liquid solder paste gel 10cc 42g 183°C for BGA SMD SMT repair Rosfix
No clean soldering flux and liquid solder paste gel 10cc 42g 183°C for BGA SMD SMT repair Rosfix
No clean soldering flux and liquid solder paste gel 10cc 42g 183°C for BGA SMD SMT repair Rosfix
No clean soldering flux and liquid solder paste gel 10cc 42g 183°C for BGA SMD SMT repair Rosfix
No clean soldering flux and liquid solder paste gel 10cc 42g 183°C for BGA SMD SMT repair Rosfix
No clean soldering flux and liquid solder paste gel 10cc 42g 183°C for BGA SMD SMT repair Rosfix
No clean soldering flux and liquid solder paste gel 10cc 42g 183°C for BGA SMD SMT repair Rosfix
No clean soldering flux and liquid solder paste gel 10cc 42g 183°C for BGA SMD SMT repair Rosfix

No clean soldering flux and liquid solder paste gel 10cc 42g 183°C for BGA SMD SMT repair Rosfix

Brand: Rosfix - ZESTAW-N72D-UEQO
Sold by: Habitium
€20.83
Free shipping From 3 to 6 business days
No clean soldering flux and liquid solder paste gel 10cc 42g 183°C for BGA SMD SMT repair Rosfix

No clean soldering flux and liquid solder paste gel 10cc 42g 183°C for BGA SMD SMT repair Rosfix

€20.83 VAT included VAT included

€20.83 VAT included VAT included

No clean soldering flux and liquid solder paste gel 10cc 42g 183°C for BGA SMD SMT repair Rosfix

Product details

  • No-clean flux: This flux does not require cleaning after soldering, helping to make electronics work faster and cleaner.
  • Gel consistency: The gel format enables precise and controlled application, making it suitable for delicate SMD and BGA components.

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Product details - No clean soldering flux and liquid solder paste gel 10cc 42g 183°C for BGA SMD SMT repair Rosfix

  • No-clean flux: This flux does not require cleaning after soldering, helping to make electronics work faster and cleaner.
  • Gel consistency: The gel format enables precise and controlled application, making it suitable for delicate SMD and BGA components.
  • Solder paste: The solder paste has a melting point of 183°C and is suitable for numerous electronic assembly and repair applications, providing reliable and durable joints.
  • Wetting performance: Its high intensity and wetting properties ensure correct tin adhesion without affecting integrated circuits or printed circuit boards.
  • Precise soldering: The formula prevents molten metal from adhering where it should not, helping to avoid short circuits and damage to sensitive components.
  • Residue removal: Residues can be easily removed with isopropyl alcohol to keep surfaces clean after soldering.
  • Pack contents: Includes 1 10cc syringe of NC-559-ASM flux and 1 42g jar of XGSP50 liquid solder paste for immediate and versatile use.
  • Compatibility: Suitable for SMT SMD BGA reballing and electronic component repair on printed circuit boards.
  • Recommended use: Designed for electronic circuit assembly and repair, pre-coating BGA pads with tin-lead alloy and precision work in advanced electronics.
  • Technical data: Sn63/Pb37 alloy, particle size 25–38 microns, viscosity 50 Pa·s and resin-and-solvent-based flux.
  • Storage: Store between 0°C and 10°C to maintain optimum properties.

Product classification::

This product belongs in the category Welding (welders): with tin (handheld, electronic, plastic).

SKU: 5905954120857, ZESTAW-N72D-UEQO

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