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Liquid soldering paste syringe 35 g no clean silver Sn63Pb37 183°C BGA GSM 20 to 38 microns Rosfix
Brand: Rosfix - A1V3-8E6L
Sold by: Habitium
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Product details
- Precise application: The 35 g liquid soldering paste syringe is designed for precise application in electronic soldering processes.
- No Clean technology: No Clean technology eliminates the need for cleaning after soldering, simplifying the process and preventing residue.
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Product details - Liquid soldering paste syringe 35 g no clean silver Sn63Pb37 183°C BGA GSM 20 to 38 microns Rosfix
- Precise application: The 35 g liquid soldering paste syringe is designed for precise application in electronic soldering processes.
- No Clean technology: No Clean technology eliminates the need for cleaning after soldering, simplifying the process and preventing residue.
- Silver formula: The silver formula improves wetting and ensures a high-quality connection on electronic components.
- Melting temperature: The melting temperature is 183°C, making it suitable for the Sn63Pb37 alloy and ideal for assembly and reballing work on BGA pads and GSM applications.
- Flux composition: The resin and solvent-based flux provides efficient flow during heating, ensuring uniform and reliable soldering.
- Particle size: The particle size is between 20 and 38 microns, optimised for fine and precise soldering.
- Viscosity: The viscosity is 50 Pa·s, enabling controlled application and preventing dripping or excess paste.
- Compatibility: The paste is compatible with hot air, infrared and convection soldering equipment, adapting to different industrial and repair methods.
- Recommended use: It is recommended for pre-tinning BGA pads and electronic assembly processes requiring leaded soldering.
- Storage: Store between 0°C and 10°C to preserve the product's properties and ensure maximum effectiveness.
- Package contents: The package contains 1 35 g XG-Z40 soldering paste syringe with technical and safety instructions on the packaging.
Product classification::
SKU: 5905954101733, A1V3-8E6L