Main risks

• Electrostatic discharge (ESD) damage that can render modules or the motherboard inoperative.
• Breakage of latches or slots and bending of the module due to incorrect or forced insertion.
• Incompatibilities that may prevent the system from booting or cause freezes and loss of unsaved data.
• Overheating due to insufficient ventilation or inappropriate performance settings.
• Short circuits if the equipment is handled while connected to the mains.
• Minor injuries when handling tools or from sharp edges, and risk of small parts being ingested by children or pets.

Safe use

• Turn off the system, disconnect it from the mains and wait a few seconds before opening it; discharge residual electricity by pressing the power button.
• Avoid ESD: work on a non-conductive surface, touch an earthed metal part or use an anti-static wrist strap.
• Check compatibility with your system (form factor, generation and supported capacity) by consulting the manufacturer’s manual.
• Handle modules by the edges; do not touch the gold contacts or the chips, and avoid bending them.
• Align the module’s notch with the slot and press evenly until the latches click into place; do not force the insertion.
• If you mix modules, prioritise identical kits; mixing different models can reduce stability.
• Avoid frequency or voltage changes not recommended by the manufacturer; check temperatures and stability after installation.
• After assembly, confirm that the system recognises the memory and run basic tests if you notice instability.

Storage and maintenance

• Store uninstalled modules in their sealed anti-static bag, in a dry, cool place away from dust and moisture.
• Protect against shocks, pressure and vibrations; do not place weight on the modules.
• Avoid exposure to liquids, condensation and sources of direct heat or intense sunlight.
• Cleaning: remove dust with compressed air; if cleaning contacts is essential, use a soft cloth lightly moistened with isopropyl alcohol and allow to dry completely before installing.
• Periodically check that the modules are properly seated and that the system’s airflow is adequate; clean the inside of the chassis to prevent dust build-up.

Usage restrictions

• Do not install or remove memory with the system powered on or connected to the mains.
• Do not force installation into incompatible slots (for example, DIMM vs SO-DIMM).
• Do not bend, pierce or modify the modules, nor remove heatsinks or technical labels.
• Do not use in environments with high humidity, extreme temperatures or a build-up of static electricity.
• Do not mix types, capacities or speeds if the equipment manufacturer advises against it.
• Keep out of reach of children and pets, including anti-static bags and small accessories.
• On very compact systems or those with complex access (laptops, all-in-one), if you lack assembly experience, seek qualified technical assistance.